Transient Hot Strip On-a-Chip Method for the Measurement of Thermal Conductivity: Uncertainty Assessment

International Journal of Thermophysics 2026

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Authors: Ulf Hammerschmidt

DOI: 10.1007/s10765-026-03775-x

Cited by: 1

References: 24

Fields of Study & Subjects

Thermal properties of materials 3D IC and TSV technologies Silicon Carbide Semiconductor Technologies

References 24