Determination and characteristics of β-Sn twin boundaries in Sn–Ag–Cu micro-solder joints

Journal of Materials Science 2026

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Authors: Chieh-Pu Tsai, Zhong-Yen Yu, Lijun Yang, C. W. Hsu, Kai-Chi Lin, Chih-Wen Chiu, Chung-Yu Chiu, Jui-Shen Chang, Chen-Nan Chiu, David T. Chu, Yao-Chun Chuang, Cheng‐Yi Liu
DOI: 10.1007/s10853-025-12118-4
Cited by: 0
References: 32

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Electrical Contact Performance and Analysis

Publication details

Journal / source
Journal of Materials Science
Volume
61
Issue
6
Pages
4315–4328
Publication date
8 January 2026
Language
EN