First-principles study of Ni intermediate layer effects on γ-Fe/Cu interface
Fields of Study & Subjects
Magnetic properties of thin films
Copper Interconnects and Reliability
Fusion materials and technologies
Publication details
- Journal / source
- Journal of Materials Science
- Publisher
- Springer Science and Business Media LLC
- Volume
- 61
- Issue
- 26
- Pages
- 18706–18716
- Publication date
- 20 May 2026
- Language
- EN