Copper nanoparticle sintering technology for power electronics packaging-preparation, process, and performance

Journal of Materials Science 2026

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Authors: Xiuqi Wang, Fengrui Zhu, Lihua Zhu, M. Y. Li, H. Ji

DOI: 10.1007/s10853-026-12760-6

Cited by: 1

References: 131

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Nanomaterials and Printing Technologies Copper Interconnects and Reliability

References 131