Ultra-low thermal conductivity and dielectric stability in novel high-entropy perovskite oxides for advanced thermal and electronic applications
Fields of Study & Subjects
High-Temperature Coating Behaviors
High Entropy Alloys Studies
Thermal properties of materials
Publication details
- Journal / source
- Journal of Materials Science Materials in Electronics
- Publisher
- Springer Science and Business Media LLC
- Volume
- 37
- Issue
- 3
- Publication date
- 1 January 2026
- Language
- EN