Effects of TiO2 nanoparticles on mechanical and corrosion properties of Cu/SAC305–xTiO2/Cu solder joints: experiments and theoretical calculations

Journal of Materials Science Materials in Electronics 2026

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Authors: Rugao Huang, Langfeng Zhu, Hu Xf, Jinghui Fan, Zhixiang Wu, Wenjing Chen
DOI: 10.1007/s10854-026-16586-5
Cited by: 1
References: 47

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Aluminum Alloys Composites Properties Nanomaterials and Printing Technologies

Publication details

Journal / source
Journal of Materials Science Materials in Electronics
Publisher
Springer Science and Business Media LLC
Volume
37
Issue
3
Publication date
1 January 2026
Language
EN