Influence of critical phosphorus content on interfacial reactions in solid-state soldering with electroplated Co–P diffusion barriers

Journal of Materials Science Materials in Electronics 2026

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Authors: Chao-hong Wang, Che-yang Lin

DOI: 10.1007/s10854-026-16590-9

Cited by: 1

References: 30

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Intermetallics and Advanced Alloy Properties

References 30