An improved unified creep‐plasticity constitutive model for viscoplastic solder materials of electronic packaging subjected to high-strain-rate impact loadings

Journal of Materials Science Materials in Electronics 2026

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Authors: Ning An, Bofeng Li, Yuexing Wang, Xiangyu Sun, Xu He

DOI: 10.1007/s10854-026-16591-8

Cited by: 2

References: 27

Fields of Study & Subjects

High-Velocity Impact and Material Behavior Energetic Materials and Combustion Boron and Carbon Nanomaterials Research

References 27