Optimizing fatigue damage of through-silicon via based on the real microstructure

Journal of Materials Science Materials in Electronics 2026

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Authors: Daoming Tian, Jiahao Liu, Fangzhou Chen, Zhenhai Chen, Xiaodong Jian, Xiangjun Lu, Bin Zhou, Hao Zhao

DOI: 10.1007/s10854-026-16643-z

Cited by: 1

References: 29

Fields of Study & Subjects

3D IC and TSV technologies Advanced Surface Polishing Techniques Electronic Packaging and Soldering Technologies

References 29