Microstructural evolution and comprehensive property evaluation of Sn-Bi-Ag lead-free solder alloys

Journal of Materials Science Materials in Electronics 2026

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Authors: Jun Sheng, Ben Liu, Ya Liu, Zhiqiu Guo, Changjun Wu, Junxiu Chen, Xuping Su
DOI: 10.1007/s10854-026-16703-4
Cited by: 0
References: 53

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Welding Techniques and Residual Stresses

Publication details

Journal / source
Journal of Materials Science Materials in Electronics
Volume
37
Issue
5
Publication date
1 February 2026
Language
EN