Effect of Ti content on the microstructure evolution and solder joint reliability of SAC305-2.0Sb-3.0Bi-0.1Ni lead-free solder alloy

Journal of Materials Science Materials in Electronics 2026

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Authors: Jiangshan Liu, Jiayi Xu, Senlin Yi, Xiu Yan Li, Hongyang Tan, Biao Wang, Jikang Yan

DOI: 10.1007/s10854-026-16758-3

Cited by: 2

References: 33

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Intermetallics and Advanced Alloy Properties Metallurgical and Alloy Processes

References 33