The effect of germanium on microstructure and mechanical properties of Sn–58Bi–5In alloy

Journal of Materials Science Materials in Electronics 2026

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Authors: Tairan Cui, Jian Lin, Tongju Wang, Tao Yuan, Yongping Lei

DOI: 10.1007/s10854-026-16778-z

Cited by: 0

References: 19

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Welding Techniques and Residual Stresses

References 19