Al2O3/Cu nanowire/Al2O3 sandwich architecture for high-performance flexible transparent conductive thin films
Fields of Study & Subjects
Nanomaterials and Printing Technologies
Advanced Sensor and Energy Harvesting Materials
Electronic Packaging and Soldering Technologies
Publication details
- Journal / source
- Journal of Materials Science Materials in Electronics
- Publisher
- Springer Science and Business Media LLC
- Volume
- 37
- Issue
- 4
- Publication date
- 1 February 2026
- Language
- EN