Mechanistic insights into the interfacial and plastic behavior of nano-tungsten reinforced Sn–Bi lead-free alloys

Journal of Materials Science Materials in Electronics 2026 Open access

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Authors: Jaeyeon Yi, Jiwan Kang, Sri Harini Rajendran, Jae Pil Jung, Ashutosh Sharma, Hyun-Sik Kim

DOI: 10.1007/s10854-026-16886-w

Cited by: 0

References: 48

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Welding Techniques and Residual Stresses Metallurgical and Alloy Processes

References 48