Rice husk ash-enhanced Sn–5.0Sb-0.7Cu (SSC507) solder: Intermetallic layer growth and diffusion behavior

Journal of Materials Science Materials in Electronics 2026

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Authors: T. T. Dele-Afolabi, M. A. Azmah Hanim, O. J. Ojo-Kupoluyi, Abdul Azeez Olayiwola Sirajudeen, Yusuf Olanrewaju Busari, A. O. Adeleke
DOI: 10.1007/s10854-026-17105-2
Cited by: 1
References: 49

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Semiconductor materials and interfaces

Publication details

Journal / source
Journal of Materials Science Materials in Electronics
Publisher
Springer Science and Business Media LLC
Volume
37
Issue
10
Publication date
1 April 2026
Language
EN