Influence of de-paneling on moisture incubation and challenges in PCB reliability under highly humid conditions

Journal of Materials Science Materials in Electronics 2026

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Authors: Rajarshi Sarkar, Cher Ming Tan, Debraj Banerjee, Atharva Navanath Korade
DOI: 10.1007/s10854-026-17286-w
Cited by: 1
References: 24

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Nanomaterials and Printing Technologies Wood Treatment and Properties

Publication details

Journal / source
Journal of Materials Science Materials in Electronics
Publisher
Springer Science and Business Media LLC
Volume
37
Issue
11
Publication date
1 April 2026
Language
EN