Study on microstructure evolution and thermo‑mechanical reliability of low-Ag SACBNI solders

Journal of Materials Science Materials in Electronics 2026

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Authors: L Wang, Shuang Zhao, Yuanyuan Qiao, Ning Zhao

DOI: 10.1007/s10854-026-17474-8

Cited by: 1

References: 54

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Electrical Contact Performance and Analysis

References 54