Oxalic acid-mediated enhancement of Cu–Cu joint performance under moderate sintering conditions

Journal of Materials Science Materials in Electronics 2026

View at publisher
Authors: Yupan Zhang, Hongjie Xu, Songya Feng, Benfang He, Yue Liao, Zhiyong Xue
DOI: 10.1007/s10854-026-17587-0
Cited by: 1
References: 34

Fields of Study & Subjects

Advanced materials and composites Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

Publication details

Journal / source
Journal of Materials Science Materials in Electronics
Publisher
Springer Science and Business Media LLC
Volume
37
Issue
15
Publication date
1 May 2026
Language
EN