Investigating the curing process of an epoxy resin with DSC, DEA and rotational rheometry
Fields of Study & Subjects
Epoxy Resin Curing Processes
Thermal and Kinetic Analysis
Rheology and Fluid Dynamics Studies
Publication details
- Journal / source
- Journal of Thermal Analysis and Calorimetry
- Publication date
- 3 March 2026
- Language
- EN