An International Round-Robin Study on Thermoelectric Module Testing and Development of Standard Power Generation Modules

Journal of Electronic Materials 2026

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Authors: Hsin Wang, Shengqiang Bai, Hugo Bouteiller, Alexandre Cuenat, Pablo Díaz-Chao, Nolan Goth, J. Liao, Jan Konig, Jay R. Maddux, Min-Wook Oh, Trevor Parker, James R. Salvador
+4 more Qingfeng Song, Patrick J. Taylor, Dimitri Vasilevskiy, Paul Verdier
DOI: 10.1007/s11664-025-12624-w
Cited by: 0
References: 28

Fields of Study & Subjects

Advanced Thermoelectric Materials and Devices Heusler alloys: electronic and magnetic properties Metallurgical and Alloy Processes

Publication details

Journal / source
Journal of Electronic Materials
Volume
55
Issue
4
Pages
3402–3417
Publication date
5 January 2026
Language
EN