Material Property Simulation for Advanced Packaging

Journal of Electronic Materials 2026

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Authors: Yan Li, S. Kim, Santosh Shaw, WooPoung Kim, Mohammad Atif Faiz Afzal, H. Shaun Kwak, David A. Nicholson
DOI: 10.1007/s11664-025-12636-6
Cited by: 1
References: 21

Fields of Study & Subjects

Synthesis and properties of polymers 3D IC and TSV technologies Electronic Packaging and Soldering Technologies

Publication details

Journal / source
Journal of Electronic Materials
Publisher
Springer Science and Business Media LLC
Volume
55
Issue
2
Pages
1664–1673
Publication date
3 January 2026
Language
EN