Effects of MoS2 Content on the Microstructure and Mechanical Properties of Low-Melting-Temperature Sn-Bi Solder Joints

Journal of Electronic Materials 2026

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Authors: Hyeon Tae Kim, Jeong‐Won Yoon

DOI: 10.1007/s11664-025-12644-6

Cited by: 3

References: 26

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Intermetallics and Advanced Alloy Properties Electrical Contact Performance and Analysis

References 26