Microstructural Evolution and Electrical Reliability of TiO2-Reinforced SAC Solder Interconnections under Thermomechanical Fatigue

Journal of Electronic Materials 2026

View at publisher

Authors: Suleiman Ibrahim Mohammad, Asokan Vasudevan, S Sujai, Premananda Pradhan, Nivin Joy Thykattusserry, Ranveer Singh, Yashwant Singh Bisht

DOI: 10.1007/s11664-025-12669-x

Cited by: 3

References: 40

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Nanomaterials and Printing Technologies Copper Interconnects and Reliability

References 40