Effect of Shapes of Silica Abrasives on the Performance of Chemical Mechanical Polishing for Silicon Wafers

Journal of Electronic Materials 2026

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Authors: Yiting Li, Zuozuo Wu, Daming Wang, Yangjian Li, Jianwei Cao, Shuai Yuan, Deren Yang
DOI: 10.1007/s11664-026-12672-w
Cited by: 2
References: 43

Fields of Study & Subjects

Advanced Surface Polishing Techniques Nanofabrication and Lithography Techniques Mineral Processing and Grinding

Publication details

Journal / source
Journal of Electronic Materials
Publisher
Springer Science and Business Media LLC
Volume
55
Issue
3
Pages
3221–3235
Publication date
22 January 2026
Language
EN