Formation and Growth Mechanisms of Preferentially Oriented Roof-type CuGa2 Grains on (111) Nanotwinned Cu

Journal of Electronic Materials 2026

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Authors: S. Meng, X. Y. Liu, M. L. Huang

DOI: 10.1007/s11664-026-12723-2

Cited by: 1

References: 31

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Copper Interconnects and Reliability

References 31