Crystal Plasticity Simulations of Subgrain Formation in Sn-based Solders During Thermal Cycling
Abstract
Abstract Tin-based solder joints are widely used to provide high-density interconnection in microelectronic packaging. Experiments show that under repetitive temperature cycling, subgrains may nucleate in the tin phase, contributing to early degradation. We present numerical simulations on a board-level packaging stack-up during cool-down and under thermal cycling. A crystal plasticity model and thermomechanical anisotropy are utilized to study the deformation of the solder joints. With this model, we can quantify the contributions to the deformation from the joint location versus the result of thermoelastic anisotropy during thermal cycling.
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
Microstructure and mechanical properties
Welding Techniques and Residual Stresses
Publication details
- Journal / source
- Journal of Electronic Materials
- Volume
- 55
- Issue
- 5
- Pages
- 4580–4589
- Publication date
- 16 March 2026
- Language
- EN