Integrated CALPHAD–Machine Learning–Experimental Framework for Thermodynamic Design of Lead-Free Bi–In–Sn Solder Alloys

Journal of Electronic Materials 2026

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Authors: Shanker Kumar, Mukesh Raushan Kumar

DOI: 10.1007/s11664-026-12898-8

Cited by: 1

References: 28

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Machine Learning in Materials Science Advanced Thermoelectric Materials and Devices

References 28