Research on a Glass Core Substrate Based on TGV Technology
Fields of Study & Subjects
Thin-Film Transistor Technologies
3D IC and TSV technologies
Silicon and Solar Cell Technologies
Publication details
- Journal / source
- Journal of Electronic Materials
- Publisher
- Springer Science and Business Media LLC
- Volume
- 55
- Issue
- 7
- Pages
- 6488–6496
- Publication date
- 11 May 2026
- Language
- EN