First-Principles Study on the Mechanical Properties and Electronic Structure of (Mn, Zn)-Doped Cu-Sn Intermetallic Compounds

Journal of Electronic Materials 2026

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Authors: Jiangshan Liu, Senlin Yi, Xiaoru Wang, ZHAO Jian, Jikang Yan

DOI: 10.1007/s11664-026-12946-3

Cited by: 1

References: 32

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Heusler alloys: electronic and magnetic properties Metallurgical and Alloy Processes

References 32