Multi-field Coupling Analysis of the High-Temperature Ultrasonic Embossing Process

Journal of Materials Engineering and Performance 2026

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Authors: Zhijian Huang, Zhangfeng Zhou, Zhen Meng, Xianle Huang, XiangQi Liu

DOI: 10.1007/s11665-026-13264-9

Cited by: 0

References: 36

Fields of Study & Subjects

Advanced machining processes and optimization Surface Treatment and Residual Stress Metal Forming Simulation Techniques

References 36