Unveiling the Size Effects on Microstructure, Mechanical Properties, and Thermal Conductivity of Nano-Ag Sintered at 220-280 °C

Journal of Materials Engineering and Performance 2026

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Authors: Dekui Mu, Changcheng Zheng, Congjie Wang, Ming Liu, David Yan

DOI: 10.1007/s11665-026-13291-6

Cited by: 0

References: 35

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Powder Metallurgy Techniques and Materials Thermal properties of materials

References 35