Considerations on Joining Technology of Pressure-less Sintering by Nano-Silver Pastes

Journal of Materials Engineering and Performance 2026

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Authors: C. Lili Zhang, M. Tuerpe, B. Rabay

DOI: 10.1007/s11665-026-13703-7

Cited by: 1

References: 25

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Powder Metallurgy Techniques and Materials Nanomaterials and Printing Technologies

References 25