Discussions on Darveaux Model for Fatigue Life Prediction of BGA Solder Joints

Journal of Materials Engineering and Performance 2026

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Authors: Jing Li

DOI: 10.1007/s11665-026-14094-5

Cited by: 1

References: 25

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Numerical methods in engineering

References 25