Micro electroforming of precision mold inserts with high flatness via internal stress reduction and interfacial bonding enhancement

Journal of Central South University 2026

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Authors: Lu Zhang, Meng-yao Li, Xue-bao Luo, Di Yang, B A Liu, Jing Huang, Z M Ma, Zhou Li
DOI: 10.1007/s11771-026-6328-9
Cited by: 1
References: 48

Fields of Study & Subjects

Electrodeposition and Electroless Coatings 3D IC and TSV technologies Electronic Packaging and Soldering Technologies

Publication details

Journal / source
Journal of Central South University
Publisher
Springer Science and Business Media LLC
Volume
33
Issue
7
Pages
3024–3041
Publication date
27 April 2026
Language
EN