Electromigration Reliability and Failure Mechanisms in Novel 3D Cu Stagger-via Interconnects for Advanced High-Density Fan-Out Packaging

JOM 2026

View at publisher
Authors: Kuan-Ju Shao, Meng-Chun Chiu, Jui-Yi Hu, Chien-Lung Liang, Min-Yan Tsai, Lin Yung-Sheng, Chen-Chao Wang, Chih-Pin Hung, Kwang‐Lung Lin
DOI: 10.1007/s11837-025-08069-5
Cited by: 2
References: 67

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

Publication details

Journal / source
JOM
Publisher
Springer Science and Business Media LLC
Volume
78
Issue
6
Pages
5188–5206
Publication date
7 January 2026
Language
EN