Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys

JOM 2026

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Authors: Wei-Ting Lin, Chia-Jung Hsu, Po-Kai Chang, Kelvin Li, K.M. Lin, Chang-Meng Wang, Albert T. Wu

DOI: 10.1007/s11837-026-08175-y

Cited by: 1

References: 25

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Electrical Contact Performance and Analysis Nanomaterials and Printing Technologies

References 25