Thermodynamic modelling of the Cd–Nd system

Bulletin of Materials Science 2026

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Authors: Jinming Liu, Quan Du, Xiaolong Huang, Baojun Han, Chenyang Zhou
DOI: 10.1007/s12034-025-03520-4
Cited by: 0
References: 22

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Thermodynamic and Structural Properties of Metals and Alloys Metallurgical and Alloy Processes

Publication details

Journal / source
Bulletin of Materials Science
Volume
49
Issue
1
Publication date
9 January 2026
Language
EN