A novel approach for performance improvements of TSV and TTSV of 3D IC through thermoelectric effect and mechanical reliability analysis

Sadhana 2026

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Authors: Debika Chaudhuri, Hafizur Rahaman, Tamal Ghosh

DOI: 10.1007/s12046-026-03073-0

Cited by: 0

References: 39

Fields of Study & Subjects

3D IC and TSV technologies VLSI and Analog Circuit Testing Advanced MEMS and NEMS Technologies

References 39