Experimental study on micro grinding of silicon wafer using polycrystalline diamond tool

Journal of Mechanical Science and Technology 2026

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Authors: Jae Yeon Kim, Ji Hyo Lee, Won Chan Park, Bo Hyun Kim

DOI: 10.1007/s12206-026-0242-6

Cited by: 3

References: 38

Fields of Study & Subjects

Advanced Surface Polishing Techniques Nanofabrication and Lithography Techniques Advanced Machining and Optimization Techniques

References 38