Current Research Status of Micro-Electro-Mechanical Systems (MEMS) Packaging Process Equipment

International Journal of Precision Engineering and Manufacturing 2026

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Authors: Juanjuan Gao, Jiahua Xia, Yue Lu, J. Z. Zhao, Fusheng Liang, Zhao Wang, Yue Yang, Cheng Fan, Tao Chen
DOI: 10.1007/s12541-026-01501-z
Cited by: 1
References: 33

Fields of Study & Subjects

3D IC and TSV technologies Advanced MEMS and NEMS Technologies Electronic Packaging and Soldering Technologies

Publication details

Journal / source
International Journal of Precision Engineering and Manufacturing
Publisher
Springer Science and Business Media LLC
Volume
27
Issue
8
Pages
3479–3516
Publication date
7 April 2026
Language
EN