Cobalt Binary Compounds for Advanced Interconnect Materials

Electronic Materials Letters 2026 Open access

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Authors: Gyungho Maeng, Yeonghun Lee

DOI: 10.1007/s13391-026-00632-9

Cited by: 1

References: 54

Fields of Study & Subjects

Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies Electrodeposition and Electroless Coatings

References 54