Effects of the Dielectric Curing Temperature on the Interfacial Adhesion Characteristics of Photosensitive Polyimide/Cu RDL Structures for Fan-Out Packages

Electronic Materials Letters 2026

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Authors: Doheon Kim, Gahui Kim, Daeyoon Jeong, Young-Bae Park
DOI: 10.1007/s13391-026-00650-7
Cited by: 1
References: 28

Fields of Study & Subjects

Synthesis and properties of polymers Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

Publication details

Journal / source
Electronic Materials Letters
Publisher
Springer Science and Business Media LLC
Publication date
13 May 2026
Language
EN