“Conductive Adhesives Are Superior to Solder”
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
Nanomaterials and Printing Technologies
Welding Techniques and Residual Stresses
Publication details
- Journal / source
- adhesion ADHESIVES + SEALANTS
- Volume
- 23
- Issue
- 1
- Pages
- 22–25
- Publication date
- 1 March 2026
- Language
- EN