“Conductive Adhesives Are Superior to Solder”

View at publisher
Cited by: 0

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Nanomaterials and Printing Technologies Welding Techniques and Residual Stresses

Publication details

Journal / source
adhesion ADHESIVES + SEALANTS
Volume
23
Issue
1
Pages
22–25
Publication date
1 March 2026
Language
EN