Stress analysis and optimization of CSP solder joints in embedded substrates under torsional loading using a GA-BP neural network

Welding in the World 2026

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Authors: Lixiang Huang, Chunyue Huang, Chao Gao, Gui Ping Wang

DOI: 10.1007/s40194-025-02305-x

Cited by: 1

References: 17

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Numerical methods in engineering

References 17