Effect of Ni content on interfacial structure and tensile strength of SACSBN/Cu solder joints

Welding in the World 2026

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Authors: Yipeng Xiang, Biao Wang, Jiayi Xu, Jikang Yan

DOI: 10.1007/s40194-025-02321-x

Cited by: 1

References: 34

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Electrical Contact Performance and Analysis 3D IC and TSV technologies

References 34