Research progress on high thermal conductivity Cu/diamond composites and interfacial bonding

Welding in the World 2026

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Authors: Shannan Zhang, Tao Wang, Jianhui Zhu, Mingqi Tang, Jian Qin, Guanxing Zhang, Tianran Ding, Quanming Liu, Xian Dong, Jiangtao Hou
DOI: 10.1007/s40194-026-02330-4
Cited by: 2
References: 119

Fields of Study & Subjects

Aluminum Alloys Composites Properties 3D IC and TSV technologies Advanced ceramic materials synthesis

Publication details

Journal / source
Welding in the World
Publisher
Springer Science and Business Media LLC
Volume
70
Issue
6
Pages
2419–2439
Publication date
22 January 2026
Language
EN