Enhancing properties, microstructure and interfacial reaction of SnBiIn solder with nickel-coated carbon nanotubes

Welding in the World 2026 Open access

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Authors: Zheng Liu, Yang Zheng, Yucong He, Yu Zhang, Yaocheng Zhang, Qiang Liu, Li Yang

DOI: 10.1007/s40194-026-02533-9

Cited by: 0

References: 22

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Nanomaterials and Printing Technologies

References 22