Magnetic–Dielectric Synergy in One-Dimensional Metal Heterostructures for Enhanced Low-Frequency Microwave Absorption

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Authors: Feiyue Hu, P. Zhang, Pei Dao Ding, Shuo Zhang, Bingbing Fan, Ali Saffar Shamshirgar, Wei Zheng, Wenwen Sun, Longzhu Cai, Haijiao Xie, Qiyue Shao, J. Rosen
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Cited by: 41
References: 60

Abstract

Abstract Microwave absorption (MA) materials often face poor synergy between impedance matching and attenuation in the low-frequency range. Balancing permittivity and permeability through magnetic–dielectric synergy is a promising strategy to address this issue. To realize the synergy, herein, Sn whiskers with an in situ oxide layer served as substrates for magnetic-loss-active CoNi nanosheet growth, forming a hierarchical CoNi@SnO 2 @Sn (CNS) heterostructure. The CNS absorber achieves a minimum reflection loss ( RL min ) value of − 62.29 dB with an effective absorption bandwidth (EAB) of 2.2 GHz, covering the entire C-band with 70% absorption at only 2.61 mm thickness. The nanosheet design of CoNi enhances magnetic anisotropy to promote natural resonance, while the conductive Sn core and abundant Sn/SnO 2 and CoNi/SnO 2 heterointerfaces facilitate conduction loss and dielectric polarization. When composited into a thermoplastic polyurethane (TPU) matrix, the resulting CNS/TPU-2 film (20 wt% CNS) exhibits an RL min value of -61.04 dB and a 2.5 GHz EAB. Its in-plane and through-plane thermal conductivities reach 2.41 and 0.51 W m −1 K −1 , representing 4.1 and 2.6 times those of pure TPU films, respectively, facilitating heat dissipation from protected devices. This work provides valuable insights into magnetic–dielectric synergy for low-frequency MA of 1D metal-based materials, offering promising potential for 5G communications and flexible electronics.

Fields of Study & Subjects

Electromagnetic wave absorption materials Metamaterials and Metasurfaces Applications Magnetic Properties and Synthesis of Ferrites

Publication details

Journal / source
Nano-Micro Letters
Publisher
Springer Science and Business Media LLC
Volume
18
Issue
1
Pages
155–155
Publication date
5 January 2026
Language
EN