Advances in TMDs-Based Electromagnetic Wave Absorbers: From Structural Engineering to Multicomponent Synergy

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Authors: Yuefeng Yan, Anqi Lun, Boshi Gao, Yuhao Liu, Dechang Jia, Yu Zhou, Xiaoxiao Huang
Cited by: 1
References: 242

Abstract

Transition metal dichalcogenides (TMDs) have garnered considerable attention as advanced electromagnetic wave absorption (EMA) materials due to their unique layered structures, tunable electronic properties, and intrinsic defect-induced polarization mechanisms. This comprehensive review systematically summarizes recent advances in TMDs-based absorbers, with particular focus on two fundamental development strategies. The first involves multiscale structural design of pure phase TMDs spanning from atomic to submillimeter dimensions, achieved through precise defect regulation, phase engineering, and sophisticated morphological manipulation to optimize electromagnetic parameters and attenuation capabilities. The second strategy focuses on constructing multicomponent composite systems, incorporating dielectric matrices, magnetic elements, and multicomponent hybrids to achieve synergistic enhancement through interfacial polarization, conductive loss, and magnetic dissipation mechanisms. The review critically analyzes pioneering research achievements across various subfields while identifying specific challenges and opportunities within each domain. Future perspectives highlight emerging frontiers including atomic level interface engineering, inverse design of multicomponent and multiscale architectures, sustainable large-scale synthesis techniques, and development of multifunctional smart-response systems. This work aims to establish fundamental principles and provide forward-looking guidance for designing next-generation high-performance TMDs-based EMA materials with tailored functionalities.

Fields of Study & Subjects

Electromagnetic wave absorption materials Metamaterials and Metasurfaces Applications MXene and MAX Phase Materials

Publication details

Journal / source
Nano-Micro Letters
Publisher
Springer Science and Business Media LLC
Volume
19
Issue
1
Publication date
3 August 2026
Language
EN