Interface engineering of Cu/Cu2O nanowires on Cu foam: boosting C–H bond cleavage and suppressing OH− adsorption for efficient formaldehyde electrooxidation

Science China Materials 2026

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Authors: Weixin Lv, Linlin Pan, Xu Zhang, Chongchong Wang, Meijie Wei, Rui Zhang, Wei Wang, Lei Wang

DOI: 10.1007/s40843-025-3880-8

Cited by: 1

References: 42

Fields of Study & Subjects

Electrocatalysts for Energy Conversion Catalytic Processes in Materials Science Chemical Looping and Thermochemical Processes

References 42